Here's a detailed product description for Silver Back Fill Compounds, formatted in Markdown:
Silver Back™ Electrically Conductive Fill Compounds
Unleash the full potential of your electronic assemblies with Silver Back™ Electrically Conductive Fill Compounds. These premium, silver-filled, electrically and thermally conductive materials are engineered for critical applications where reliable electrical pathways, superior thermal management, and robust EMI/RFI shielding are paramount.
Whether you're repairing a delicate PCB, creating a secure ground plane, attaching a heat sink, or encapsulating sensitive components, Silver Back™ compounds provide unmatched performance and durability.
Key Features & Advantages:
Exceptional Electrical Conductivity: Formulated with high-purity silver particles, ensuring ultra-low volume resistivity for reliable electrical connections and signal integrity.
Superior Thermal Conductivity: Efficiently dissipates heat away from critical components, extending product lifespan and improving performance in thermally demanding environments.
Robust Adhesion: Bonds strongly to a wide range of substrates including metals, ceramics, plastics, and composites, providing a durable and reliable connection.
Excellent EMI/RFI Shielding: Creates effective barriers against electromagnetic and radio-frequency interference, crucial for sensitive electronics.
Wide Operating Temperature Range: Maintains performance integrity across extreme temperatures, from cryogenic to high-heat applications.
Low Shrinkage: Minimizes stress on components and maintains precise dimensions after curing, ensuring long-term reliability.
Versatile Curing Options: Available in room temperature cure (RTV) and heat-curable formulations to suit various production processes and desired cure times.
Chemical & Moisture Resistance: Offers excellent protection against harsh chemicals, solvents, and moisture, enhancing product longevity in challenging conditions.
Customizable Viscosity: Available in various viscosities, from pourable liquids to thixotropic pastes, for different application methods (dispensing, screen printing, brushing).
Unrivaled Benefits for Your Applications:
Enhanced Reliability: Create lasting electrical and thermal connections that withstand the rigors of operation.
Optimized Performance: Ensure sensitive electronics function at their peak, free from interference and thermal degradation.
Reduced Rework: High-quality bonds and conductivity minimize failures and costly repairs.
Design Flexibility: Solve complex conductivity and thermal management challenges with a single, versatile material.
Cost-Effective: While premium, the longevity and performance of Silver Back™ compounds reduce long-term maintenance and replacement costs.
Heat Sink Attachment: Securely bonding heat sinks to microprocessors, LEDs, and power components.
EMI/RFI Gasketing & Sealing: Creating conductive seals for enclosures and connectors to prevent interference.
Grounding & Shielding: Establishing ground planes and creating conductive pathways for EMI/RFI shielding.
Die Attach & Encapsulation: Bonding semiconductor dies and encapsulating sensitive sensors for protection and connectivity.
Medical Device Assembly: For applications requiring precise conductivity and robust bonding.
Automotive & Aerospace Electronics: Meeting stringent requirements for conductivity, thermal management, and environmental resistance.
Creating Conductive Traces: Prototyping and creating custom conductive patterns.
Technical Specifications (Typical for a 2-Part Epoxy System):
Property
Value / Description
Test Method (Example)
Color (Mixed)
Silver-Gray
Visual
Binder System
Epoxy (customizable)
N/A
Filler
High-Purity Silver
N/A
Volume Resistivity
< 0.0005 Ohm-cm
ASTM D257
Thermal Conductivity
2.5 – 5.0 W/mK
ASTM D5470
Pot Life (Mixed)
30 minutes @ 25°C (varies by product)
Internal
Cure Schedule (Typical)
24 hours @ 25°C or 2 hours @ 80°C
Internal
Operating Temperature
-55°C to +180°C (continuous)
Internal
Adhesion Shear Strength
> 15 MPa (Aluminum to Aluminum)
ASTM D1002
Hardness (Cured)
Shore D 85
ASTM D2240
Thinner/Cleaner
Acetone, Isopropyl Alcohol (before cure)
N/A
Note: Specific values may vary depending on the exact Silver Back™ product variant (e.g., epoxy-based, silicone-based, or acrylic-based).
Why Choose Silver Back™ Fill Compounds?
When your application demands uncompromising performance, longevity, and precision, Silver Back™ is the conductive fill compound you can trust. Our advanced formulations are rigorously tested to ensure they meet the highest standards of quality and reliability, giving you confidence in every connection.
How to Use:
Preparation: Ensure surfaces are clean, dry, and free from oil, grease, and other contaminants. Light abrasion can improve adhesion on some substrates.
Mixing (for 2-part systems): Carefully mix Part A and Part B according to the specified ratio until a uniform color is achieved. Avoid incorporating air bubbles. For single-part systems, no mixing is required.
Application: Apply the compound evenly to the desired area using a syringe, spatula, brush, or dispensing equipment.
Curing: Allow the compound to cure according to the recommended schedule (room temperature or heat cure) until fully hardened.
Availability:
Silver Back™ Electrically Conductive Fill Compounds are available in a variety of packaging options to suit your needs:
Pre-measured Syringe Kits: For precise application and minimal waste.
Dual Cartridges: For easy mixing and dispensing.
Bulk Containers: For high-volume production.
Contact us for custom packaging or specific viscosity requirements.
Safety & Handling:
Please refer to the Material Safety Data Sheet (MSDS) for detailed safety information. Always wear appropriate personal protective equipment (gloves, eye protection) and work in a well-ventilated area. Store in a cool, dry place away from direct sunlight.
Elevate your designs. Secure your connections. Choose Silver Back™.
