High-Quality Copper Clad Laminate Sheets for Diverse Applications
Our Copper Clad Laminate Sheets offer a reliable and high-performance solution for a wide range of applications, particularly in the electronics industry. These sheets consist of a thin layer of high-conductivity copper bonded to a robust insulating substrate, providing excellent electrical conductivity, mechanical strength, and thermal stability. Whether you're building printed circuit boards (PCBs), creating prototypes, or working on other projects requiring conductive materials, our sheets deliver exceptional quality and consistent performance.
Key Features & Benefits:
Specifications:
Parameter | Value (Example - Adjust based on actual product offerings) | Units |
---|---|---|
Substrate Material | FR-4, CEM-1, CEM-3 | |
Copper Thickness | 1 oz, 1.5 oz, 2 oz | oz/ft² |
Sheet Size | 24" x 48", 36" x 48", Customizable | inches |
Dielectric Constant | 4.0-4.6 (FR-4 Example) | |
Dissipation Factor | 0.02 (FR-4 Example) | |
Tensile Strength | Varies by substrate | psi |
Applications:
Ordering Information:
Please contact us for detailed pricing and availability. Specify your required substrate material, copper thickness, and sheet size when placing your order. Custom sizes are available upon request.
Note: The specifications listed above are typical values. Actual values may vary slightly. Please contact us for the complete technical specifications sheet for a specific product.