Description

Boron Nitride Cooling Filler Agglomerates CFA 250S: High-Performance Thermal Management Solution

CFA 250S are agglomerated boron nitride (BN) particles specifically engineered for demanding thermal management applications requiring exceptional heat dissipation and superior thermal conductivity. These high-performance filler agglomerates offer a unique combination of properties, making them ideal for a wide range of industries and applications.

Key Features & Benefits:

• Exceptional Thermal Conductivity: CFA 250S boasts significantly higher thermal conductivity compared to traditional fillers, enabling efficient heat transfer and improved cooling performance in your systems. This leads to reduced operating temperatures and enhanced component lifespan.
• High Thermal Stability: Maintain consistent thermal performance across a broad temperature range, ensuring reliable operation even under extreme conditions. The material exhibits excellent resistance to thermal shock.
• Low Density: The agglomerated structure provides a lower density compared to solid BN particles, resulting in lighter weight composites without compromising thermal performance. This is particularly beneficial in aerospace and automotive applications.
• Excellent Chemical Inertness: CFA 250S demonstrates exceptional chemical resistance, ensuring long-term stability and preventing degradation in various environments and matrices. This makes it compatible with a wide range of resins and bonding agents.
• Easy Dispersibility: Designed for ease of incorporation into various matrix materials, minimizing processing challenges and ensuring uniform distribution for optimal thermal conductivity.
• Customizable Particle Size Distribution: Available with a customizable particle size distribution to precisely tailor the thermal and mechanical properties of the final composite material to your specific application needs. (Contact us for details on custom options).

Typical Applications:

• Electronics Cooling: Heat sinks, thermal interface materials (TIMs), potting compounds for high-power electronics, LED lighting applications.
• Aerospace Components: High-temperature applications, thermal protection systems, lightweight composite structures.
• Automotive Parts: Brake pads, heat shields, engine components requiring enhanced heat dissipation.
• Industrial Manufacturing: High-temperature tooling, molding compounds, refractory materials.

Technical Specifications:

• Material: Boron Nitride (BN) Agglomerates
• Particle Size: (Specify range – this will need to be provided by the manufacturer) Example: Average particle size 25-50µm
• Bulk Density: (Specify value – this will need to be provided by the manufacturer) Example: 0.5 g/cm³
• Thermal Conductivity: (Specify value and units – this will need to be provided by the manufacturer) Example: > 100 W/m·K
• Specific Heat: (Specify value and units – this will need to be provided by the manufacturer)
• Color: White to off-white

Packaging: Available in various packaging sizes to suit your requirements. (Specify available sizes)

Safety Precautions: While generally considered safe, standard safety precautions for handling fine powders should be followed. Refer to the Safety Data Sheet (SDS) for detailed information.

Note: The provided specifications are typical values and may vary slightly depending on the specific batch. For precise specifications and detailed technical data, please contact us.