Description

Boron Nitride Cooling Filler Platelets: CFP 001 & 003SF

Revolutionizing Thermal Management with Superior Boron Nitride Platelets

Our Boron Nitride (BN) Cooling Filler Platelets, CFP 001 and 003SF, offer unparalleled thermal conductivity and superior performance for demanding thermal management applications. These high-quality platelets provide efficient heat dissipation, enhancing the performance and longevity of your electronic components and systems.

CFP 001: The Versatile Choice

• Exceptional Thermal Conductivity: CFP 001 boasts a high thermal conductivity, effectively transferring heat away from heat-generating sources. (Specific value to be inserted here, e.g., > 100 W/mK)
• Excellent Electrical Insulation: Provides robust electrical insulation, preventing short circuits and ensuring the safety of your devices.
• Chemical Inertness: Resistant to a wide range of chemicals and solvents, ensuring long-term stability and performance.
• High Purity: Manufactured with high purity BN, minimizing impurities and maximizing thermal performance.
• Versatile Applications: Suitable for a wide range of applications, including thermal interface materials (TIMs), adhesives, potting compounds, and more.
• Particle Size: (Insert specific particle size range here, e.g., 1-5 µm)
• Typical Applications: LED lighting, power electronics, microelectronics packaging, and high-power laser diodes.

CFP 003SF: Enhanced Performance for Extreme Conditions

CFP 003SF builds upon the strengths of CFP 001, offering enhanced performance characteristics specifically designed for applications requiring superior heat dissipation and stability:

• Superior Thermal Conductivity: Exhibits even higher thermal conductivity compared to CFP 001, making it ideal for extreme heat flux situations. (Specific value to be inserted here, e.g., > 150 W/mK)
• Improved Dispersion: Enhanced surface treatment ensures superior dispersion within the matrix material, resulting in optimized thermal performance.
• Enhanced Stability: Maintains its thermal properties under high temperatures and harsh operating conditions.
• Particle Size: (Insert specific particle size range here, e.g., 2-8 µm)
• Typical Applications: High-power electronics, aerospace applications, military electronics, and advanced semiconductor packaging.

Key Features (Both CFP 001 & 003SF):

• High Purity Boron Nitride: Ensures superior thermal performance and reliability.
• Excellent Thermal Stability: Maintains its properties over a wide temperature range.
• Ease of Dispersal: Easily integrated into various matrix materials.
• Cost-Effective Solution: Offers high performance at a competitive price.
• Environmentally Friendly: Manufactured with environmentally conscious processes.

Packaging and Availability:

Both CFP 001 and CFP 003SF are available in various package sizes to meet your specific needs. (Specify packaging options here, e.g., 100g, 500g, 1kg bottles; custom packaging available) Contact us for pricing and availability.

Technical Data Sheet:

For detailed technical specifications, including specific thermal conductivity values, particle size distributions, and other relevant data, please download the technical data sheet for CFP 001 and CFP 003SF from (Insert link to datasheet here).

Contact Us:

For inquiries, custom formulations, or bulk orders, please contact us at (Insert contact information here). We are dedicated to providing you with the highest quality boron nitride platelets and exceptional customer service.